Material de sellado conductor eléctrico

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Material de sellado conductor eléctrico

Material de sellado conductor eléctrico

Parker Chomerics family of CHO-BOND electrically conductive adhesives, sealants/gap fillers, caulks, and greases provide a variety of solutions for solving EMI problems beyond that which can be addressed simply with EMI gasketing.

Parker Chomerics CHO BOND® 1016 is a one-component, nickel-plated graphite filled conductive sealant formulated to provide galvanic corrosion resistance when mated with aluminum substrates
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Parker Chomerics CHO-BOND 1018 is a nickel-aluminum filled, two-component electrically conductive polythioether designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding.
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Parker Chomerics CHO-BOND 1019 is a silver-plated aluminum filled electrically conductive polythioether sealant designed to be used in harsh environments due to its excellent fluid and fuels resistance.
Viendo 10 de 1
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Parker Chomerics CHO BOND® 1035 is a one-component, silver-plated glass filled sealant formulated to provide lightweight EMI shielding in commercial and military applications
Viendo 10 de 3
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Parker Chomerics CHO BOND® 1038 is a one component, silver-plated copper filled sealant formulated to serve as gap filler for EMI shielding or electrical grounding
Viendo 10 de 5
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Parker Chomerics CHO BOND® 1075 is a one component, silver-plated aluminum filled sealant formulated to resist galvanic corrosion on aluminum substrates while providing excellent shielding and conductivity
Viendo 10 de 3
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Parker Chomerics CHO-BOND® 1077 is a nickel plated aluminum filled, one-component conductive silicone designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding.
Viendo 10 de 2
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Parker Chomerics CHO-BOND® 1086 is an air-drying liquid coating used to improve the adhesion of CHO-BOND 1016, 1030, 1035, 1038, 1075 electrically conductive adhesives/sealants and CHOTHERM® 1641 thermal compound.
Viendo 10 de 3
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Parker Chomerics CHO BOND® 1121 is a one component, VOC-free, silver-plated copper filled sealant formulated to serve as gap filler for EMI shielding or electrical grounding
Viendo 10 de 1
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Parker Chomerics CHO BOND® 2165 is a two-component, stabilized-copper filled sealant specifically formulated for Aerospace and Military applications
Viendo 10 de 3
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Parker Chomerics CHO BOND® 4660 is a one-component, silver-plated copper filled conductive sealant specifically formulated for flexibility in applications where vibration resistance is required
Viendo 10 de 2
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Parker Chomerics CHO BOND® 4669 is a one-component, silver-plated copper filled conductive sealant specifically formulated for extended working life and flexibility in applications where vibration resistance is required
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Parker Chomerics PRO-SHIELD® 7201 Primer is an air-drying liquid coating used to improve the adhesion of PRO-SHIELD electrically conductive adhesives/sealants and paints.
Viendo 10 de 2
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Parker Chomerics TECKNIT 0002 is a one component, silver-filled conductive sealant formulated to be a gap filler that provides EMI shielding or grounding on electrical enclosures
Viendo 10 de 1
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Parker Chomerics TECKNIT 0005 is a one component silver-plated glass filled conductive sealant specially formulated to remain flexible for gaps or seams meant to be disassembled
Viendo 10 de 1
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Portable conductive adhesive and sealant dispense guns are ideal for touch ups or low volume assembly work.
Viendo 10 de 3
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