CHO-BOND 4660 Silver-Plated Copper Filled Polyisobutylene Electrically Conductive Sealant | Product Series

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CHO-BOND 4660 Silver-Plated Copper Filled Polyisobutylene Electrically Conductive Sealant

CHO-BOND 4660 Silver-Plated Copper Filled Polyisobutylene Electrically Conductive Sealant

Parker Chomerics CHO BOND® 4660 is a one-component, silver-plated copper filled conductive sealant specifically formulated for flexibility in applications where vibration resistance is required

Especificaciones técnicas

  • Opciones de material de polímero: Polyisobutylene
  • Material de relleno: Silver-plated copper
  • Tipo de paquete: 2 Fluid Ounce Aluminum Foil Tube, 0.1 Gallon Fiber Cartridge
  • Cebado incluido: Not Required
  • Color: Black
  • Resistividad volumétrica: 0.080 Ω-cm
  • Gravedad específica: 2.06
  • Durómetro: n/a
  • Temperatura de funcionamiento: -55 to 100 °C
  • Horas de servicio: 0.5 Hours
  • Vida útil en depósito: 6 Months
  • Grosor de la película: 0.18 to 3.18 mm

Descripción completa del producto

Parker Chomerics CHO BOND® 4660 is a one-component, silver-plated copper filled conductive sealant specifically formulated for flexibility in applications where vibration resistance is required. CHO BOND® 4660 is a black-colored material that possesses identical properties of CHO BOND® 4669 except for a shortened working life.

Features and Benefits:
• One-component system so no mixing or measuring required
• Good conductivity levels (0.080 ohm-com)
• No corrosive by-products generated during drying
• No primer required
• Excellent impermeability to gases
• Minimal weight added to assembly due to lightweight material
• Easily dispensed using a standard caulking gun

Typical Applications:
• Access panels
• Shielded room joints
• Temporary military shelters
• Hardware
• Bulkhead feed-through fittings
• Building conduits

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