Parker Chomerics CHO BOND® 4669 is a one-component, silver-plated copper filled conductive sealant specifically formulated for extended working life and flexibility in applications where vibration resistance is required. CHO BOND® 4669 is a gray-colored material that possesses identical properties of CHO BOND® 4660 except for an enhanced working life. Features and Benefits:• One-component system so no mixing or measuring required• Good conductivity levels (0.080 ohm-com)• No corrosive by-products generated during drying• No primer required• Excellent impermeability to gases• Minimal weight added to assembly due to lightweight material• Easily dispensed using a standard caulking gun• 2 hour working life for applications flexibilityTypical Applications:• Access panels• Shielded room joints• Temporary military shelters• Hardware• Bulkhead feed-through fittings• Building conduits
