THERM-A-FORM T647 Cure-in-Place Potting and Underfill Materials | Product Series

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THERM-A-FORM T647 Cure-in-Place Potting and Underfill Materials

THERM-A-FORM T647 Cure-in-Place Potting and Underfill Materials

Parker Chomerics THERM-A-FORM™ T647 is a two-component. Low modulus, high thermal conductivity (3.0 W/m-k) silicone elastomer ideal for filling complex geometries and maintaining contact with electrical components.

Technical Specifications

  • Color: Gray
  • Polymer Material Options: Silicone Rubber (VMQ, PVMQ)
  • Filler Material: Aluminum Oxide
  • Product Type: 2-part
  • Specific Gravity: 2.8
  • Durometer: 25 Shore A
  • Dynamic Viscosity: > 5000 P
  • Operational Life: 300 min Pot Life
  • Maximum Cure Time (at Room Temperature): 3 min @ 150°C, 60 min @ 60°C, 48 Hours @ 23°C
  • Thermal Conductivity: 3 W/m-K
  • Heat Capacity: 0.9 J/g-K
  • Coefficient of Thermal Expansion: 150 ppm/K
  • Operating Temperature: -58 to 302 °F, -50 to 150 °C
  • Dielectric Strength: 10 kVAC/mm, 250 VAC/mil
  • Volume Resistivity: 10^14 (x1) ohm-cm
  • Dielectric Constant: 8 @ 1 MHZ
  • Dissipation Factor: 0.010 @ 1 MHZ
  • Flammability Rating: UL 94 V-0
  • Outgassing Total Mass Loss: Not Tested
  • Shelf Life: 3 Months
  • Weight: 125 g, 560 g
  • Ratio: 1:1 Mix Ratio (by weight)
Safety Warning

Full Product Description

Parker Chomerics THERM-A-FORM™ T647 is a two-component. Low modulus, high thermal conductivity (3.0 W/m-k) silicone elastomer ideal for filling complex geometries and maintaining contact with electrical components.

THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics cooling applications. These versatile liquid reactive materials can be dispensed and then cured into complex geometries for cooling of multi-height components on a PCB without the expense of a molded sheet. Each compound is available in ready-to-use cartridge systems, eliminating weighing, mixing, and degassing procedures.

Product Attributes:
• Superior thermal performance while maintaining low modulus (3.0 W/m-k thermal conductivity)
• Flows into complex geometries to maintain intimate contact with components
• UL 94 V-0 flammability rated
• High pot life (5 hours)

Features and Benefits:
• Dispensable form-in-place gap filling, potting, sealing, and encapsulating
• Excellent blend of high thermal conductivity, flexibility, and ease of use
• Conformable to irregular shapes without excessive force on components
• Ready-to-use cartridge system eliminates weighing, mixing, and de-gassing steps
• Variety of kit sizes and configurations available to suit any application (handheld twin-barrel cartridges, Semco® tubes, and pneumatic applicators)
• Vibration damping

Related Documents

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Products Package Type
65-00-T647-0045 45cc Dual Element Cartridge
65-00-T647-0200 200cc Dual Element Cartridge

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