Parker Chomerics THERM-A-FORM™ thermally conductive compounds are two-component materials that require a cure and are used on complex geometries for cooling of multiple height heat generating components without the expense of molded sheets or gap pads.  Each compound is available in ready-to-use cartridge systems, eliminating weighing, mixing, and degassing procedures. They differ from THERM-A-GAP™ GEL dispensable materials, which are single component and do not require a cure. CoolTherm® potting and encapsulants improve performance by optimizing heat dissipation with high thermal conductivity and low viscosity. They also protect components from dust and moisture and help reduce vibration.