Electrically Conductive Form-In-Place Material Gaskets

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Electrically Conductive Form-In-Place Material Gaskets

Electrically Conductive Form-In-Place Material Gaskets

Parker Chomerics robotically dispensed Form-In-Place (FIP) EMI shielding gaskets provide the lowest total cost of ownership for small cross section and complex pattern applications. Parker Chomerics CHO-FORM (conductive) and ParPHorm (non-conductive) FIP materials can reduce installed cost of an EMI gasket by up to 60%.

Parker Chomerics CHO-FORM 5575 form-in-place EMI gasket is a moisture cure silicone system with 80 dB shielding effectiveness ideal for corrosion resistance in high temperature applications.
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Parker Chomerics CHO-FORM® 5528 form-in-place EMI gasket is a moisture cure silicone system with >70 dB shielding effectiveness while providing a soft, low closure force gasket.
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Parker Chomerics CHO-FORM® 5513 form-in-place EMI gasket is a thermal cure silicone system providing >70 dB shielding effectiveness and excellent adhesion to chromate coated aluminum surfaces.
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Parker Chomerics CHO-FORM® 5560 form-in-place EMI gasket is a low hardness, thermal cure silicone system with >90 dB shielding effectiveness and excellent galvanic corrosion resistance.
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Parker Chomerics CHO-FORM® 5550 form-in-place EMI gasket is a low hardness, thermal cure silicone system with >65 dB shielding effectiveness and good galvanic corrosion resistance.
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Parker Chomerics CHO-FORM® 5538 form-in-place EMI gasket is a moisture cure silicone system used in small bead size applications while providing >65 dB shielding effectiveness and good galvanic corrosion resistance.
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Parker Chomerics CHO-FORM® 5526 form-in-place EMI gasket is a one-component, moisture cure silicone system with >100 dB shielding effectiveness while providing a soft, low closure force gasket.
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Parker Chomerics CHO-FORM® 5541 form-in-place EMI gasket is a thermal cure silicone system with >65 dB shielding effectiveness, good galvanic corrosion resistance and superb adhesion properties.
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Parker Chomerics PARPHORM® 1800 non-conductive, moisture cure silicone elastomer is designed for enclosures that require low closure force, excellent adhesion, and very good compression set qualities.
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Parker Chomerics PARPHORM® L1938 non-conductive, fluorosilicone material is a thermal cure system specially designed for fluid resistance applications.
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Note: This product is no longer available - please refer to the “Product Support" or "Recommended products" section of this page for details on any alternative products, or contact us for further assistance.
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