Parker Chomerics CHO-FORM® family of conductive form-in-place gasket materials are ideal for densely populated electronics packaging, especially where intercompartmental isolation is required. The form-in-place characteristics mean that CHO-FORM® can be used in rapid prototyping applications on substrates such as castings, machined metal, conductive plastic housings, and at board level.
Parker Chomerics CHO-FORM® 5538 form-in-place EMI gasket is a one-component, moisture cure silicone system capable of small bead size applications while providing greater than 65 dB shielding effectiveness and good galvanic corrosion resistance with mated aluminum surfaces. CHO-FORM® 5538 consists of a Ni/Graphite particle filler and utilizes an enhanced moisture cure technology which requires ONLY 4 hours at 50% relative humidity for complete cure. It can be dispensed in the smallest bead size of any Chomerics form-in-place material with bead size dimensions of 0.015 x 0.020 inches.
Features and Benefits:
• Up to 60% reduced installation cost and nominal cost for production scale-up
• Up to 60% space savings within enclosures (gasketing available for flanges as narrow as 0.025 in)
• Excellent adhesion to common housing substrates (4-12 N/cm adhesion)
• Highly compressible gaskets, ideal for low closure force housings
• Quick turn-around of prototypes and samples
Parker Chomerics Capabilities:
• Fully programmable 3 axis application technology
• Tight dimensional control and bead termination (0.001-inch tolerance of bead size)
• Automated dimensional verification of gasket bead placement using optical measuring technology
Typical Applications:
• Densely populated electronics packaging
• PCB inter-compartmental isolation with thin wall boundaries
• Castings, machined metal, and conductive plastic enclosures
• Transportation/Automotive sensor housing
• Military and Aerospace electronics
• Telecom
• Life Science
