THERM-A-GAP GEL 75 Thermally Conductive Gel | #65-02-GEL75-0180


LOADING IMAGES
65-02-GEL75-0180

THERM-A-GAP GEL 75 Thermally Conductive Gel | #65-02-GEL75-0180

Parker Chomerics THERM-A-GAP™ GEL 75 fully cured dispensable gel has 7.5 W/m-K Thermal Conductivity as a one component fully cured system.


Technical Specifications

  • Package Type: 180cc EFD Plastic Cartridge
  • Color: Light Gray, Pink
  • Flow Rate: 30 g/min, 24 g/min
  • Specific Gravity: 3.4, 2.85
  • Thermal Conductivity: 7.5 W/m-K, 2.4 W/m-K
  • Heat Capacity: 1 J/g-K, 1.257 J/g-K
  • Coefficient of Thermal Expansion: 150 ppm/K, < 300 ppm/K
  • Operating Temperature: -67 to 392 °F, -67 to 392 °F, -55 to 200 °C
  • Dielectric Strength: 220 VAC/mil, 200 VAC/mil
  • Volume Resistivity: 10^14 ohm-cm, 10^12 ohm-cm
  • Dielectric Constant: 7.4 @ 1 MHZ, 7.4 @ 1 MHZ
  • Dissipation Factor: 0.003 @ 1 MHZ, 0.003 @ 1 MHZ
  • Flammability Rating: UL 94 V-0
  • Outgassing Total Mass Loss: 0.18 % TML (0.05% CVCM), 0.18 % TML (0.03% CVCM)
  • Shelf Life: 18 Months
  • Minimum Bondline Thickness: 0.008 inch, 0.004 inch, 0.20 mm, 0.10 mm
  • Polymer Material Options: Silicone Rubber (VMQ, PVMQ)
Safety Warning

Item Information

Parker Chomerics THERM-A-GAP GEL 75 is a high performance, one component, dispensable thermal interface material with 7.5 W/m-K thermal conductivity developed to conduct heat from electronics to a heat sink or enclosure.

The material’s heavy paste-like consistency enables controlled dispensing, applied in variable thicknesses to suit application needs. THERM-A-GAP GEL 75 requires low compressive force to deform under assembly pressure subjecting components, solder joints and leads to minimal stresses.

It is formulated to accommodate today’s high performance electronics and is ideal for automated dispensing machines, rework and field repair situations.

Features and Benefits:

• Thermal conductivity: 7.5 W/m-K
• Easily dispensed
• No secondary curing required
• Low thermal impedance
• Low compression force
• Reworkable

Typical Applications:

• Thermal heat dissipation for telecom base stations
• Power supplies and semiconductors
• Memory and power modules
• Microprocessors
•Central processing units (CPUs)

Read More Show Less

CAD Drawings + Files

No CAD files available

Ok

x

Related Documents

×

Quantity:
Request a Quote

The item has been successfully added to your quote cart Go to Quote Cart

x

Ok

x

Find a Distributor

Where to Buy

Local Contact

South Africa Headoffice

Parker Hannifin (Africa) Pty LTD

Sales Company South Africa

10 Berne Avenue

Aeroport

Kempton Park

Gauteng

South Africa

1620

Phone

0027 11 961 0700

Get your Parker account Today!

Create one account to manage everything you do with Parker, from your shopping preferences to your application access.

687466
179336