THERM-A-GAP GEL 75 Thermally Conductive Gel | Product Series

Filter by

    No filters selected

Package Type

Get your Parker account Today!

Create one account to manage everything you do with Parker, from your shopping preferences to your application access.


LOADING IMAGES
THERM-A-GAP GEL 75 Thermally Conductive Gel

THERM-A-GAP GEL 75 Thermally Conductive Gel

Parker Chomerics THERM-A-GAP™ GEL 75 fully cured dispensable gel has 7.5 W/m-K Thermal Conductivity as a one component fully cured system.

Technical Specifications

  • Specifications Met: UL 94 V-0, RoHS
  • Color: Light Gray
  • Flow Rate: 30 g/min
  • Specific Gravity: 3.4
  • Thermal Conductivity: 7.5 W/m-K
  • Heat Capacity: 1 J/g-K
  • Coefficient of Thermal Expansion: 150 ppm/K
  • Operating Temperature: -67 to 392 °F, -55 to 200 °C
  • Dielectric Strength: 220 VAC/mil
  • Volume Resistivity: 10^14 ohm-cm
  • Dielectric Constant: 7.4 @ 1 MHZ
  • Dissipation Factor: 0.003 @ 1 MHZ
  • Flammability Rating: UL 94 V-0
  • Outgassing Total Mass Loss: 0.18 % TML (0.05% CVCM)
  • Shelf Life: 18 Months
  • Minimum Bondline Thickness: 0.008 inch, 0.20 mm
  • Polymer Material Options: Silicone Rubber (VMQ, PVMQ)
Safety Warning

Full Product Description

Parker Chomerics THERM-A-GAP GEL 75 is a high performance, one component, dispensable thermal interface material with 7.5 W/m-K thermal conductivity developed to conduct heat from electronics to a heat sink or enclosure.

The material’s heavy paste-like consistency enables controlled dispensing, applied in variable thicknesses to suit application needs. THERM-A-GAP GEL 75 requires low compressive force to deform under assembly pressure subjecting components, solder joints and leads to minimal stresses.

It is formulated to accommodate today’s high performance electronics and is ideal for automated dispensing machines, rework and field repair situations.

Features and Benefits:

• Thermal conductivity: 7.5 W/m-K
• Easily dispensed
• No secondary curing required
• Low thermal impedance
• Low compression force
• Reworkable

Typical Applications:

• Thermal heat dissipation for telecom base stations
• Power supplies and semiconductors
• Memory and power modules
• Microprocessors
•Central processing units (CPUs)

Related Documents

×
Products Package Type
65-00-GEL75-0010 10cc Manual Dispense Syringe
65-02-GEL75-0030 30cc Luer Lock Syringe
65-02-GEL75-0180 180cc EFD Plastic Cartridge
65-00-GEL75-0300 300cc Aluminum Cartridge
65-1P-GEL75-2500 2500cc Pail (1 US Gal.)
65-5P-GEL75-7350 7350cc Pail (5 US Gal.)

687466
179336