Get your Parker account Today!
Create one account to manage everything you do with Parker, from your shopping preferences to your application access.
Parker Chomerics CHO-BOND® 360-20 conductive adhesive is a two-component, silver-plated copper filled epoxy formulated for exceptionally strong electrical bonds
Parker Chomerics CHO-BOND® 360-20 conductive adhesive is a two-component, silver-plated copper filled epoxy formulated for exceptionally strong electrical bonds. CHO-BOND® 360-20 is a light grey-colored epoxy adhesive that provides a cost-effective and electrically conductive joint material for large bond line filling. Features and Benefits:• Silver-plated copper filler is a low cost solution to electrical conductivity options• Good conductivity levels (0.005 ohm-com)• Strong adhesion properties (>1600 PSI lap shear strength)• Thick paste makes it effective for overhead and vertical surface applications• No volatile organic compounds• 1:1 mix ratio makes measurement and application very easyTypical Applications:• Gap filling in electrical boxes• Electrical enclosures• Poorly toleranced castings• EMI vents and windows• Vertical and overhead fillet applications
No CAD files available
South Africa Headoffice
Parker Hannifin (Africa) Pty LTD
Sales Company South Africa
10 Berne Avenue
Aeroport
Kempton Park
Gauteng
South Africa
1620
Phone
0027 11 961 0700
Create one account to manage everything you do with Parker, from your shopping preferences to your application access.