CHO-BOND 360-20 TWO COMPONENT GENERAL PURPOSE ELECTRICALLY CONDUCTIVE EPOXY ADHESIVE | Product Series

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CHO-BOND 360-20 TWO COMPONENT GENERAL PURPOSE ELECTRICALLY CONDUCTIVE EPOXY ADHESIVE

CHO-BOND 360-20 TWO COMPONENT GENERAL PURPOSE ELECTRICALLY CONDUCTIVE EPOXY ADHESIVE

Parker Chomerics CHO-BOND® 360-20 conductive adhesive is a two-component, silver-plated copper filled epoxy formulated for exceptionally strong electrical bonds

Technical Specifications

  • Polymer Material Options: Epoxy
  • Filler Material: Silver-plated Copper
  • Package Type: 2 Component, 1/2 Pint Aluminum Can Kit, 2 Component, 1 Pint Aluminum Can Kit
  • Primer Included: Not Required
  • Ratio: 1:1 by weight
  • Color: Light Gray
  • Volume Resistivity: 0.005 Ω-cm
  • Lap Shear Strength: 11032 kPa
  • Specific Gravity: 5
  • Durometer: 80
  • Operating Temperature: -62 to 100 °C
  • Operating Time: 1.0 Hours
  • Shelf Life: 9 Months
  • Film Thickness: 0.25 mm
Safety Warning

Full Product Description

Parker Chomerics CHO-BOND® 360-20 conductive adhesive is a two-component, silver-plated copper filled epoxy formulated for exceptionally strong electrical bonds. CHO-BOND® 360-20 is a light grey-colored epoxy adhesive that provides a cost-effective and electrically conductive joint material for large bond line filling.

Features and Benefits:
• Silver-plated copper filler is a low cost solution to electrical conductivity options
• Good conductivity levels (0.005 ohm-com)
• Strong adhesion properties (>1600 PSI lap shear strength)
• Thick paste makes it effective for overhead and vertical surface applications
• No volatile organic compounds
• 1:1 mix ratio makes measurement and application very easy

Typical Applications:
• Gap filling in electrical boxes
• Electrical enclosures
• Poorly toleranced castings
• EMI vents and windows
• Vertical and overhead fillet applications

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Products Weight (g)
50-00-0360-0020 85
50-01-0360-0020 454

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