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Parker Chomerics CHO-BOND® 360-20 conductive adhesive is a two-component, silver-plated copper filled epoxy formulated for exceptionally strong electrical bonds
Literature and Reference Materials |
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Datasheet: CHO-BOND 360-20 |
Contact & Support Information |
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Request a Chomerics Product Sample |
Find Your Local Parker Chomerics Sales Rep or Distributor |
Request a Quote |
Products | Weight (g) |
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50-00-0360-0020 | 85 |
50-01-0360-0020 | 454 |