Expansion controllers - IQAN-XC21/XC22/XC23 | #20077792


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Expansion controllers - IQAN-XC21/XC22/XC23 | #20077792

IQAN-XC23 expansion controller


Especificaciones técnicas

  • Número de modelo: IQAN-XC23
  • Voltaje de suministro eléctrico: 9 to 32 VDC
  • Temperatura máxima de funcionamiento: 70 °C
  • Temperatura mínima de funcionamiento: -30 °C
  • Número de entradas: 20
  • Número de salidas: 8
  • Grado de protección de admisión: 66
  • Cumplimiento con especificaciones: 2004/108/EC
  • Conexión eléctrica: Deutsch DTM
  • Corriente de salida nominal: 300 mA
  • Material del alojamiento: Plastic
  • Industria: Agriculture, Construction, Forestry, Material Handling, Specialty, Transportation
  • Tipo de controlador: Slave/Expansion Module
Safety Warning

Información del artículo

The IQAN-XC23 is an IQANdesign platform expansion module. This type of unit is a small dimension I/O module to be used as an expansion unit in an IQAN control system. All IQAN expansion modules communicate with a master over a CAN bus, using the IQAN CAN protocol. The IQAN-XC23 module has I/O flexibility that allows the user freedom in defining signals for measurement and control. The IQAN-XC23 has up to 20 digital inputs for connection to switches. Up to 8 of these inputs may be configured as voltage inputs for connection of 0-5 Vdc signals from resistive or Hall-effect sensors and joysticks. The remaining 12 inputs can be configured as up to 10 frequency inputs and 1 encoder input for measuring speed and position. The module's low power digital outputs are designed for driving low power loads such as relays, LEDs or alarm buzzers. The outputs share pins with the inputs and are configured using IQAN software. The IQAN-XC23 is designed for outdoor use on mobile machinery. It uses 3 keyed Deutsch DTM connectors to prevent wiring mix-ups. The module has addressing in the wiring harness through use of an IDtag; the addressing of the IQAN-XC23 allows up to 8 modules of this type on the bus. The housing is designed for stacking multiple modules, providing a high density of I/O in a small footprint.

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