PRO-SHIELD 7058 ELECTRICALLY CONDUCTIVE EPOXY ADHESIVE | Product Series

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PRO-SHIELD 7058 ELECTRICALLY CONDUCTIVE EPOXY ADHESIVE

PRO-SHIELD 7058 ELECTRICALLY CONDUCTIVE EPOXY ADHESIVE

Parker Chomerics PRO-SHIELD 7058 electrically conductive epoxy combines the strong adhesive characteristics of epoxy with the superior conductivity of pure silver. Click into part number to purchase online now.

Especificaciones técnicas

  • Opciones de material de polímero: Epoxy
  • Material de relleno: Silver
  • Resistividad volumétrica: 0.005 Ω-cm
  • Resistencia a la cizalla por tracción: 8274 kPa
  • Gravedad específica: 2.7
  • Durómetro: 80 Shore D
Safety Warning

Descripción completa del producto

Parker Chomerics PRO-SHIELD 7058 is a two-component, silver filled conductive epoxy adhesive system designed for applications where a strong, highly conductive electrical bond must be achieved.

PRO-SHIELD 7058 is recommended for relatively small bond lines (less than 0.010 inches (0.25mm)), but can be used for larger bond lines in applications where vibration or potential for cracking is not an issue. The fine silver filler of PRO-SHIELD 7058 makes it a good material choice for precise application in and around tight spaces and electrical components.

PRO-SHIELD 7058 comes in a 50cc dual syringe with a static mixer, minimizing material scrap and mixing issues. Curing of PRO-SHIELD 7058 can be achieved in as little as 15 minutes with heat to minimize equipment downtime and increase manufacturing throughput.

Typical applications:
• Bonding and grounding of electrical components
• Cold soldering
• Bonding and sealing machined enclosures

Features and Benefits:
• Two component
• Fast heat cure, increases throughput, minimizes equipment downtime
• Silver filler
• 0.002 ohm-cm electrical conductivity
• Epoxy
• 30-minute working life, works well over wide temperature range, good chemical resistance >1200 psi lap shear, good for permanently bonding surfaces.
• Multiple packaging options
• No weighing required, mix and dispense in same package, minimizes process scrap.
• Thin paste
• May be dispensed out of very small needles, fill small cracks and voids.
• Low VOCs
• Minimal shrinkage

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