CHO-BOND 584-208 TWO COMPONENT ELECTRICALLY CONDUCTIVE EPOXY ADHESIVE SYSTEM | Product Series

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CHO-BOND 584-208 TWO COMPONENT ELECTRICALLY CONDUCTIVE EPOXY ADHESIVE SYSTEM

CHO-BOND 584-208 TWO COMPONENT ELECTRICALLY CONDUCTIVE EPOXY ADHESIVE SYSTEM

Parker Chomerics CHO-BOND® 584-208 conductive adhesive is a two-component epoxy formulated with an extended working life ideal for high volume applications where a strong electrical bond is required

Especificaciones técnicas

  • Opciones de material de polímero: Epoxy
  • Material de relleno: Silver
  • Cebado incluido: Not Required
  • Relación: 1:1 by weight
  • Color: Silver
  • Resistividad volumétrica: 0.002 Ω-cm
  • Resistencia a la cizalla por tracción: 6895 kPa
  • Gravedad específica: 2.6
  • Durómetro: 80
  • Temperatura de funcionamiento: -62 to 100 °C
  • Horas de servicio: 1.0 Hours
  • Vida útil en depósito: 9 Months
  • Grosor de la película: 0.03 mm
Safety Warning

Descripción completa del producto

Parker Chomerics CHO-BOND® 584-208 conductive adhesive is a two-component epoxy formulated with an extended working life ideal for high volume applications where a strong electrical bond is required. CHO-BOND® 584-208 is a silver-colored epoxy with a 60 minute working life meant to allow for additional application flexibility.

Features and Benefits:
• Silver filler is a premium conductivity solution to electrical bonding
• Excellent conductivity levels (0.002 ohm-com)
• Strong adhesion properties (>1000 PSI lap shear strength)
• Medium paste makes it effective for overhead and vertical surface applications
• Can be easily dispensed from a small needle for small cracks and voids
• Fast cure at elevated temperatures (45 minutes at 100°C) and room temperature cure options
• No volatile organic compounds
• 1:1 mix ratio makes measurement and application very easy

Typical Applications:
• Electrical enclosure bonding
• Electrical component grounding
• Cold soldering
• Sealing and bonding machined enclosures

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