Thermoset 311 Epoxy Encapsulant | Product Series

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Thermoset 311 Epoxy Encapsulant

Thermoset 311 Epoxy Encapsulant

Thermoset 311 epoxy encapsulant is a two-component, filled epoxy system designed for electrical & electronic applications requiring high operating temperatures and applications where high thermal shock is expected. It provides a semi-rigid epoxy system.

Especificaciones técnicas

  • Viscosidad dinámica: 29500 cP @ 77°F (25°C) (resin), 15000 cP @ 77°F (25°C) (hardener), 20000 cP @ 77°F (25°C) (mixed)
  • Hardness: 77 Shore D
  • Cure Time: 16 to 24 Hours @ 167°F (75°C), 6 to 8 Hours @ 203°F (95°C), 2 to 3 Hours @ 248°F (120°C)
  • Working Time: 2 to 3 Days @ 77°F (25°C)
  • Color: Black Liquid (resin), Tan Liquid (hardener), Black Liquid (mixed)
  • Resistencia dieléctrica: 15 kV/mm, 380 V/mil

Descripción completa del producto

Thermoset 311 epoxy encapsulant is a twocomponent, filled epoxy system designed for electrical and electronic applications requiring high operating temperatures. Thermoset 311 encapsulant provides a semi-rigid epoxy system for use in applications where high thermal shock is expected. With preheating, encapsulant can be used for vacuum impregnation applications.

Features and Benefits:
• High Temperature Electrical Performance – exhibits excellent electrical properties at operating temperatures from -55°C to 155°C.
• Environmentally Resistant – provides excellent resistance to thermal shock; provides protection of electrical devices exposed to harsh environmental conditions.
• Durable – exhibits very low weight loss over extended periods at elevated temperatures.

Shelf Life/Storage:
Shelf life of each component is six months when stored at 25°C in original, unopened container. Each component must be periodically rotated within its container to minimize settling.

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Thermoset 311 Thermoset 311 Epoxy Encapsulant

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