Electronic Potting and Encapsulation

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Electronic Potting and Encapsulation

Electronic Potting and Encapsulation

These materials are crucial in applications where fragile electronics need to be protected from environmental and chemical corrosion and vibration.

Circalok 6055 encapsulant is a two-component epoxy encapsulating system designed for encapsulating and casting applications where non-burning properties are required.
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Circalok 6250 hardener is a curing agent designed for use with various Circalok epoxy resins to obtain high solids formulations useful in adhesive, electrical encapsulation and laminate applications.
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Circalok 6403 A BLK/B urethane encapsulant is a general purpose, two-component urethane designed for applications requiring a fast cure, mechanical shock-resistant system. Circalok 6403 A BLK/B urethane encapsulant does not contain MOCA or TDI.
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Circalok 6403 A SLW/B urethane encapsulant is a general purpose, two-component urethane designed for applications requiring a fast cure, mechanical shock-resistant system. Circalok 6403 A SLW/B urethane encapsulant does not contain MOCA or TDI.
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Circalok 6408 A SLW/B urethane encapsulant is a solvent-free, two-component system designed to provide a shock-resistant sealant for encapsulating and potting applications.
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Circalok 6410 A/B urethane encapsulant is a two-component system formulated for tooling mechanical goods and model making. Circalok 6410 encapsulant is an easy handling casting elastomer designed for room temperature mixing, pouring and curing.
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Circalok 6716/6733 silicone system is a two-component, solvent-free RTV silicone system ideal for potting and encapsulating both low- and highvoltage electrical and electronic assemblies.
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Circalok 6735 encapsulant is a two-component, addition-cure silicone system for applications where high temperature service and flexible system are required. It adheres to most substrates without the use of a primer.
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Circalok 6744 encapsulant is a two-component silicone system for use in applications requiring a low viscosity, flame retardant encapsulating material.
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LORD® 600/18 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
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LORD® 600/25 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
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LORD® 600/37 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
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LORD® 600/65 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
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LORD® 600/66 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
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LORD® 600/67 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
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LORD® 600/70 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
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LORD® 600/71 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
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LORD® 975-1052 encapsulant is a two-component epoxy system designed specifically for encapsulating electronic components used in remote sensors and sensing devices. It provides a semi-rigid epoxy system for applications where thermal shock is expected.
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Thermoset 300/18 epoxy system is a two-component, general purpose filled epoxy system which offers superior thermal conductivity, improved shock resistance and lower coefficient of thermal expansion compared to unfilled epoxy systems.
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Thermoset 300/65 epoxy system is a two-component, general purpose filled epoxy system which offers superior thermal conductivity, improved shock resistance and lower coefficient of thermal expansion compared to unfilled epoxy systems.
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Thermoset 300/67 epoxy system is a two-component, general purpose filled epoxy system which offers superior thermal conductivity, improved shock resistance and lower coefficient of thermal expansion compared to unfilled epoxy systems.
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Thermoset 300/70 epoxy system is a two-component, general purpose filled epoxy system which offers superior thermal conductivity, improved shock resistance and lower coefficient of thermal expansion compared to unfilled epoxy systems.
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Thermoset 300/72 epoxy system is a two-component, general purpose filled epoxy system which offers superior thermal conductivity, improved shock resistance and lower coefficient of thermal expansion compared to unfilled epoxy systems.
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Thermoset 311 epoxy encapsulant is a two-component, filled epoxy system designed for electrical & electronic applications requiring high operating temperatures and applications where high thermal shock is expected. It provides a semi-rigid epoxy system.
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Thermoset DC-812 epoxy encapsulant is a two-component system designed specifically for potting high voltage, automotive ignition coils.
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