LORD® 975-1052 encapsulant is a two-component epoxy system designed specifically for encapsulating electronic components used in remote sensors and sensing devices. LORD 975-1052 encapsulant provides a semi-rigid epoxy system for use in applications where thermal shock is expected.
Features and Benefits:
• Low Stress – exhibits low shrinkage and stress on components as it cures.
• Room Temperature Cure – suitable for curing at room temperature; may be mildly heat cured (43-60°C) to expedite cure.
• Low Exotherm – exhibits low exothermic heat rise during room temperature cure, minimizing affect on heat-sensitive components.
• Environmentally Resistant – provides excellent resistance to mechanical and thermal shock; retains flexibility even after heat aging.
Shelf Life/Storage:
Shelf life of each component is six months when stored at 25°C in original, unopened container.
