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Parker Chomerics THERM-A-GAP™ GEL 75 fully cured dispensable gel has 7.5 W/m-K Thermal Conductivity as a one component fully cured system.
Parker Chomerics THERM-A-GAP GEL 75 is a high performance, one component, dispensable thermal interface material with 7.5 W/m-K thermal conductivity developed to conduct heat from electronics to a heat sink or enclosure.
The material’s heavy paste-like consistency enables controlled dispensing, applied in variable thicknesses to suit application needs. THERM-A-GAP GEL 75 requires low compressive force to deform under assembly pressure subjecting components, solder joints and leads to minimal stresses.
It is formulated to accommodate today’s high performance electronics and is ideal for automated dispensing machines, rework and field repair situations.
Features and Benefits:
• Thermal conductivity: 7.5 W/m-K
• Easily dispensed
• No secondary curing required
• Low thermal impedance
• Low compression force
• Reworkable
Typical Applications:
• Thermal heat dissipation for telecom base stations
• Power supplies and semiconductors
• Memory and power modules
• Microprocessors
•Central processing units (CPUs)
| Contact & Support Information |
|---|
| Request a Chomerics Product Sample |
| Find Your Local Parker Chomerics Sales Rep or Distributor |
| Request a Quote |
| Product Demos & Tutorials |
|---|
| Parker Chomerics Product Case Studies |
| Parker Chomerics Upcoming Webinars & On Demand Webinars |
| Productos | Tipo de paquete |
|---|---|
| 65-00-GEL75-0010 | 10cc Manual Dispense Syringe |
| 65-02-GEL75-0030 | 30cc Luer Lock Syringe |
| 65-02-GEL75-0180 | 180cc EFD Plastic Cartridge |
| 65-00-GEL75-0300 | 300cc Aluminum Cartridge |
| 65-1P-GEL75-2500 | 2500cc Pail (1 US Gal.) |
| 65-5P-GEL75-7350 | 7350cc Pail (5 US Gal.) |
