Parker Chomerics THERM-A-GAP GEL 75 is a high performance, one component, dispensable thermal interface material with 7.5 W/m-K thermal conductivity developed to conduct heat from electronics to a heat sink or enclosure.

The material’s heavy paste-like consistency enables controlled dispensing, applied in variable thicknesses to suit application needs. THERM-A-GAP GEL 75 requires low compressive force to deform under assembly pressure subjecting components, solder joints and leads to minimal stresses.

It is formulated to accommodate today’s high performance electronics and is ideal for automated dispensing machines, rework and field repair situations.

Features and Benefits:

• Thermal conductivity: 7.5 W/m-K
• Easily dispensed
• No secondary curing required
• Low thermal impedance
• Low compression force
• Reworkable

Typical Applications:

• Thermal heat dissipation for telecom base stations
• Power supplies and semiconductors
• Memory and power modules
• Microprocessors
•Central processing units (CPUs)