Parker Chomerics THERMFLOW® T777 is a thermally enhanced and inherently tacky phase change material designed to completely fill interfacial air gaps and voids within electronics assemblies. It is classified as Polymer Solder Hybrid Material (PSH)

The ability to completely fill air gaps and voids typical of component packages and heat sinks allows THERMFLOW® pads to achieve performance superior to any other thermal interface materials.

At room temperature, THERMFLOW® materials are solid and easy to handle. This allows them to be consistently and cleanly applied as dry pads to a heat sink or component surface. THERMFLOW® material softens as it reaches component operating temperatures. With light clamping pressure it will readily conform to both mating surfaces. Upon reaching the required melt temperature, the pad will fully change phase and attain minimum bond-line thickness (MBLT) • less than 0.001 inch or 0.0254mm, and maximum surface wetting. This results in practically no thermal contact resistance due to a very small thermal resistance path.

Product Attributes:
• Superior thermal performance
• Ideal solution for mobile microprocessors
• Dispersed solder filler offers added thermal performance
• Resin system designed for higher temperature reliability
• Inherently tacky • no adhesive required
• Tabs available for easy removal
• UL 94 V-0 flammability rated

Features and Benefits:
• Low thermal impedance
• Demonstrated reliability through thermal cycling and accelerated age testing
• Can be pre-applied to heat sinks
• Protective release liners prevent contamination
• Available in custom die-cut shapes and kiss-cut on rolls
• RoHS compliant

Typical Applications:
• Microprocessors
• Graphics processors
• Chipsets
• Memory Modules
• Power Modules
• Power Semiconductors