Parker Chomerics CHO-BOND® 592 conductive adhesive is a two-component, silver-filled epoxy with good electrical conductivity and excellent adhesion characteristics. CHO-BOND® 592 is ideal in connecting dissimilar materials both electrically and thermally.

Features and Benefits:
• Long pot life (4-6 hours at 25°C) allows for application flexibility
• Room temperature curing available
• Excellent thermal properties (low thermal impedance and good thermal shock resistance)
• Can be thinned for spray applications
• Good electrical conductivity (0.05 ohm-cm)
• Great adhesion strength (1500 PSI lap shear)

Typical Applications:
• Sealant for microwave modules and components
• Circuit board repair
• Grounding applications
• EMI shielding applications