Parker Chomerics CHO-BOND® 592 conductive adhesive is a two-component, silver-filled epoxy with good electrical conductivity and excellent adhesion characteristics. CHO-BOND® 592 is ideal in connecting dissimilar materials both electrically and thermally. Features and Benefits:• Long pot life (4-6 hours at 25°C) allows for application flexibility• Room temperature curing available• Excellent thermal properties (low thermal impedance and good thermal shock resistance)• Can be thinned for spray applications• Good electrical conductivity (0.05 ohm-cm)• Great adhesion strength (1500 PSI lap shear)Typical Applications:• Sealant for microwave modules and components• Circuit board repair• Grounding applications• EMI shielding applications
