Parker Chomerics CHO-BOND® 584-29 conductive adhesive is a two-component, silver-filled epoxy formulated for thin bond lines and where precise application is required. CHO-BOND® 584-29 is a silver-colored epoxy designed to be used in very tight applications and around electrical components.

Features and Benefits:
• Silver filler is a premium conductivity solution to electrical bonding
• Excellent conductivity levels (0.002 ohm-com)
• Strong adhesion properties (>1200 PSI lap shear strength)
• Thin paste makes it effective for easy dispensing from a small needle for small cracks and voids
• Fast cure at elevated temperatures (15 minutes at 113°C) and room temperature cure options
• Low volatile organic compounds
• Comes in standard sizes of pre-measured syringes so no mixing and measuring is required

Typical Applications
• Electrical enclosure bonding
• Electrical component grounding
• Cold soldering
• Sealing and bonding machined enclosures