CHO-BOND 584-29 TWO COMPONENT EASY TO USE CONDUCTIVE EPOXY ADHESIVE | Product Series

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CHO-BOND 584-29 TWO COMPONENT EASY TO USE CONDUCTIVE EPOXY ADHESIVE CHO-BOND 584-29 TWO COMPONENT EASY TO USE CONDUCTIVE EPOXY ADHESIVE CHO-BOND 584-29 TWO COMPONENT EASY TO USE CONDUCTIVE EPOXY ADHESIVE

CHO-BOND 584-29 TWO COMPONENT EASY TO USE CONDUCTIVE EPOXY ADHESIVE

Parker Chomerics CHO-BOND® 584-29 conductive adhesive is a two-component, silver-filled epoxy formulated for thin bond lines and where precise application is required

Especificaciones técnicas

  • Peso: 1 g, 2.5 g, 10 x 3 g, 10 g, 85 g, 454 g
  • Cebado incluido: Not Required
  • Opciones de material de polímero: Epoxy
  • Material de relleno: Silver
  • Relación: 100:6.3
  • Color: Silver
  • Resistividad volumétrica: 0.002 Ω-cm
  • Resistencia a la cizalla por tracción: 8274 kPa
  • Gravedad específica: 2.5
  • Durómetro: 80
  • Temperatura de funcionamiento: -55 to 125 °C
  • Horas de servicio: 0.5 Hours
  • Vida útil en depósito: 12 Months
  • Grosor de la película: 0.03 mm

Descripción completa del producto

Parker Chomerics CHO-BOND® 584-29 conductive adhesive is a two-component, silver-filled epoxy formulated for thin bond lines and where precise application is required. CHO-BOND® 584-29 is a silver-colored epoxy designed to be used in very tight applications and around electrical components.

Features and Benefits:
• Silver filler is a premium conductivity solution to electrical bonding
• Excellent conductivity levels (0.002 ohm-com)
• Strong adhesion properties (>1200 PSI lap shear strength)
• Thin paste makes it effective for easy dispensing from a small needle for small cracks and voids
• Fast cure at elevated temperatures (15 minutes at 113°C) and room temperature cure options
• Low volatile organic compounds
• Comes in standard sizes of pre-measured syringes so no mixing and measuring is required

Typical Applications
• Electrical enclosure bonding
• Electrical component grounding
• Cold soldering
• Sealing and bonding machined enclosures

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