Parker Chomerics CHO-BOND® 584-208 conductive adhesive is a two-component epoxy formulated with an extended working life ideal for high volume applications where a strong electrical bond is required. CHO-BOND® 584-208 is a silver-colored epoxy with a 60 minute working life meant to allow for additional application flexibility.

Features and Benefits:
• Silver filler is a premium conductivity solution to electrical bonding
• Excellent conductivity levels (0.002 ohm-com)
• Strong adhesion properties (>1000 PSI lap shear strength)
• Medium paste makes it effective for overhead and vertical surface applications
• Can be easily dispensed from a small needle for small cracks and voids
• Fast cure at elevated temperatures (45 minutes at 100°C) and room temperature cure options
• No volatile organic compounds
• 1:1 mix ratio makes measurement and application very easy

Typical Applications:
• Electrical enclosure bonding
• Electrical component grounding
• Cold soldering
• Sealing and bonding machined enclosures