Parker Chomerics CHO-BOND® 584-208 conductive adhesive is a two-component epoxy formulated with an extended working life ideal for high volume applications where a strong electrical bond is required. CHO-BOND® 584-208 is a silver-colored epoxy with a 60 minute working life meant to allow for additional application flexibility. Features and Benefits:• Silver filler is a premium conductivity solution to electrical bonding• Excellent conductivity levels (0.002 ohm-com)• Strong adhesion properties (>1000 PSI lap shear strength)• Medium paste makes it effective for overhead and vertical surface applications • Can be easily dispensed from a small needle for small cracks and voids• Fast cure at elevated temperatures (45 minutes at 100°C) and room temperature cure options• No volatile organic compounds• 1:1 mix ratio makes measurement and application very easyTypical Applications:• Electrical enclosure bonding• Electrical component grounding• Cold soldering• Sealing and bonding machined enclosures
