Parker Chomerics CHO-BOND® 360-20 conductive adhesive is a two-component, silver-plated copper filled epoxy formulated for exceptionally strong electrical bonds
Parker Chomerics CHO-BOND® 360-20 conductive adhesive is a two-component, silver-plated copper filled epoxy formulated for exceptionally strong electrical bonds. CHO-BOND® 360-20 is a light grey-colored epoxy adhesive that provides a cost-effective and electrically conductive joint material for large bond line filling. Features and Benefits:• Silver-plated copper filler is a low cost solution to electrical conductivity options• Good conductivity levels (0.005 ohm-com)• Strong adhesion properties (>1600 PSI lap shear strength)• Thick paste makes it effective for overhead and vertical surface applications• No volatile organic compounds• 1:1 mix ratio makes measurement and application very easyTypical Applications:• Gap filling in electrical boxes• Electrical enclosures• Poorly toleranced castings• EMI vents and windows• Vertical and overhead fillet applications
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Latin American Group Headquarters
Parker Hannifin Ind. e Com. Ltda.
Estrada Municipal Joel de Paula, 900
São José dos Campos
SP
Brasil
12247-015
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