CHO-BOND 360-20 TWO COMPONENT GENERAL PURPOSE ELECTRICALLY CONDUCTIVE EPOXY ADHESIVE | Product Series

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CHO-BOND 360-20 TWO COMPONENT GENERAL PURPOSE ELECTRICALLY CONDUCTIVE EPOXY ADHESIVE

CHO-BOND 360-20 TWO COMPONENT GENERAL PURPOSE ELECTRICALLY CONDUCTIVE EPOXY ADHESIVE

Parker Chomerics CHO-BOND® 360-20 conductive adhesive is a two-component, silver-plated copper filled epoxy formulated for exceptionally strong electrical bonds

Especificaciones técnicas

  • Opciones de material de polímero: Epoxy
  • Material de relleno: Silver-plated copper
  • Tipo de paquete: 2 Component, 1/2 Pint Aluminum Can Kit, 2 Component, 1 Pint Aluminum Can Kit
  • Cebado incluido: Not Required
  • Relación: 1:1 by weight
  • Color: Light Gray
  • Resistividad volumétrica: 0.005 Ω-cm
  • Resistencia a la cizalla por tracción: 11032 kPa
  • Gravedad específica: 5
  • Durómetro: 80
  • Temperatura de funcionamiento: -62 to 100 °C
  • Horas de servicio: 1.0 Hours
  • Vida útil en depósito: 9 Months
  • Grosor de la película: 0.25 mm

Descripción completa del producto

Parker Chomerics CHO-BOND® 360-20 conductive adhesive is a two-component, silver-plated copper filled epoxy formulated for exceptionally strong electrical bonds. CHO-BOND® 360-20 is a light grey-colored epoxy adhesive that provides a cost-effective and electrically conductive joint material for large bond line filling.

Features and Benefits:
• Silver-plated copper filler is a low cost solution to electrical conductivity options
• Good conductivity levels (0.005 ohm-com)
• Strong adhesion properties (>1600 PSI lap shear strength)
• Thick paste makes it effective for overhead and vertical surface applications
• No volatile organic compounds
• 1:1 mix ratio makes measurement and application very easy

Typical Applications:
• Gap filling in electrical boxes
• Electrical enclosures
• Poorly toleranced castings
• EMI vents and windows
• Vertical and overhead fillet applications

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