Parker Chomerics CHO BOND® 2165 is a two-component, stabilized-copper filled sealant specifically formulated for Aerospace and Military applications
Parker Chomerics CHO BOND® 2165 is a two-component, stabilized-copper filled sealant specifically formulated for Aerospace and Military applications. CHO BOND® 2165 is a brownish-red colored polyurethane that is often used in conjunction with CHO-SHIELD® 2000 series EMI coatings to serve as a repair kit for military aircraft. Features and Benefits:• Excellent electrical conductivity (0.010 ohm-cm)• Very good corrosion resistance on aluminum substrates• Aircraft fluid resistance • Chromate free making it environmentally friendly• Thick paste can be used on overhead or vertical surfaces• Elevated temperature cure option (15 minutes at 113°C) as well as room temperature cure optionTypical Applications:• Aircraft fastener fill• Gap Filler• Aircraft repair compound
No hay archivo CAD disponible
Latin American Group Headquarters
Parker Hannifin Ind. e Com. Ltda.
Estrada Municipal Joel de Paula, 900
São José dos Campos
SP
Brasil
12247-015
Cree una cuenta para gestionar todo lo que haga con Parker, desde sus preferencias de compra hasta su acceso a la aplicación.
