THERM-A-FORM 1642 Cure-in-Place Potting and Underfill Materials | Product Series

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THERM-A-FORM 1642 Cure-in-Place Potting and Underfill Materials

THERM-A-FORM 1642 Cure-in-Place Potting and Underfill Materials

Parker Chomerics THERM-A-FORM™ 1642 is a two-component, general duty, economical thermally conductive encapsulant/sealant/caulk with high shelf life (12 months) and low viscosity

Especificaciones técnicas

  • Color: Blue
  • Opciones de material de polímero: Silicone
  • Material de relleno: Aluminum Oxide
  • Tipo de productos: 2-part
  • Gravedad específica: 2.3
  • Durómetro: 76 (Shore A)
  • Viscosidad dinámica: 2500 poise
  • Duración de la vida útil: 60 minute pot life
  • Tiempo máximo de endurecimiento (a temperatura ambiente): 60 min @ 100°C or 4 hrs @ 65°C or 1 week @ 23°C
  • Conductividad térmica: 0.95 W/m-K
  • Capacidad de calefacción: 1 J/g-K
  • Coeficiente de expansión térmica: 200 ppm/K
  • Temperatura de funcionamiento: -94 to 392 °F (-70 to 200 °C)
  • Resistencia dieléctrica: 20 kVac/mm (500 Vac/mil)
  • Resistividad volumétrica: 1.0 x 10^13 ohm-cm
  • Constante dieléctrica: 3.9 @ 1000 kHz
  • Factor de disipación: 0.010 @ 1000 kHz
  • Clasificación de inflamabilidad: Not Tested
  • Pérdida de masa total de desgasificación: 0.40 % (0.18% CVCM)
  • Vida útil en depósito: 12 Months
  • Peso: 277 g (120 cc)
  • Relación: Mix ratio 100:3 (by weight)
  • Cebado incluido: CHO-BOND 1087

Descripción completa del producto

Parker Chomerics THERM-A-FORM™ 1642 is a two-component, general duty, economical thermally conductive encapsulant/sealant/caulk with high shelf life (12 months) and low viscosity.

THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics cooling applications. These versatile liquid reactive materials can be dispensed and then cured into complex geometries for cooling of multi-height components on a PCB without the expense of a molded sheet. Each compound is available in ready-to-use cartridge systems, eliminating weighing, mixing, and degassing procedures.

Product Attributes:
• General duty, economical thermal solution
• Two-component thermally conductive encapsulant/sealant/caulk/potting compound
• Supplied with primer 1087 (not required for cure but promotes adhesion)

Features and Benefits:
• Dispensable form-in-place gap filling, potting, sealing, and encapsulating
• Excellent blend of high thermal conductivity, flexibility, and ease of use
• Conformable to irregular shapes without excessive force on components
• Ready-to-use cartridge system eliminates weighing, mixing, and de-gassing steps
• Variety of kit sizes and configurations available to suit any application (handheld twin-barrel cartridges, Semco® tubes, and pneumatic applicators)
• Vibration damping

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