Parker Chomerics CHO-BOND® 1030 conductive adhesive is a one component silver-plated copper filled silicone ideal for thin bond lines and bonding silicone EMI gaskets to metal substrates. CHO-BOND® 1030 is a light grey-colors silicone paste that is predominantly used for bonding elastomer gaskets. Features and Benefits:• One component system so no mixing or measuring required • Silver-plated copper filler is a low cost solution to electrical bonding• Good conductivity levels (0.050 ohm-cm)• Moderate adhesion properties (>200 PSI lap shear strength)• Medium paste consistency means it can be used on overhead or vertical surfaces• No volatile organic compounds and no corrosive by-products generated when curing Typical Applications:• Sealing of EMI vents and windows• Bonding, repair, and attachment of EMI gaskets
