Parker Chomerics CHO-BOND® 1030 conductive adhesive is a one component silver-plated copper filled silicone ideal for thin bond lines and bonding silicone EMI gaskets to metal substrates. CHO-BOND® 1030 is a light grey-colors silicone paste that is predominantly used for bonding elastomer gaskets.

Features and Benefits:
• One component system so no mixing or measuring required
• Silver-plated copper filler is a low cost solution to electrical bonding
• Good conductivity levels (0.050 ohm-cm)
• Moderate adhesion properties (>200 PSI lap shear strength)
• Medium paste consistency means it can be used on overhead or vertical surfaces
• No volatile organic compounds and no corrosive by-products generated when curing

Typical Applications:
• Sealing of EMI vents and windows
• Bonding, repair, and attachment of EMI gaskets