THERM-A-GAP GEL 60HF Thermally Conductive Gel | Product Series

Create one account to manage everything you do with Parker, from your shopping preferences to your application access.

THERM-A-GAP GEL 60HF Thermally Conductive Gel

Where to Buy

Parker Chomerics THERM-A-GAP™ GEL 60HF is a single-component, fully cured, dispensable gel with 6.2 W/m-K thermal conductivity.

Technical Specifications

Specifications Met: UL 94 V-0, RoHS
Color: Grey, Black
Flow Rate: 80 g/min
Specific Gravity: 3.3
Thermal Conductivity: 6.2 W/m-K
Heat Capacity: 1 J/g-K
Coefficient of Thermal Expansion: 150 ppm/K
Operating Temperature: -67 to 392 °F, -55 to 200 °C
Dielectric Strength: 5 VAC/mil
Volume Resistivity: 10^13 ohm-cm
Dielectric Constant: 5.8 @ 100 KHZ
Dissipation Factor: 0.001 @ 1 MHZ
Flammability Rating: UL 94 V-0
Outgassing Total Mass Loss: 0.14 % TML (0.07% CVCM)
Shelf Life: 12 Months
Minimum Bondline Thickness: 0.006 inch, 0.15 mm
Polymer Material Options: Silicone Rubber (VMQ, PVMQ)

Safety Warning

Full Product Description

THERM-A-GAP GEL 60HF is part of the Parker Chomerics family of fully cured, one component silicone-based, dispensable thermal interface materials. With a 6.2 W/m-K thermal conductivity, it is designed for high performance heat transfer from electronics components to cooling features and meant to be used across industries and applications.

The “HF” in GEL 60HF stands for “High Flow”, indicating that the material is ideal for high volume dispensing applications and high throughput production operations. As with all Parker Chomerics thermal gels, it is optimized for automated dispensing at various packaging sizes while retaining properties for easy rework and field repair situations.

The paste-like consistency of THERM-A-GAP GEL 60HF enables very tightly controlled dispensing and accurate material placement during assembly. It requires low compressive force to deflect under assembly pressure, subjecting components, solder joints and PCB leads to minimal stress.

Features and Benefits:
• Thermal conductivity: 6.2 W/m-K
• High flow rate: 80g/min
• No secondary curing required
• Low thermal impedance
• Very low compression force
• Reworkable
• Room temperature storage

Typical Applications:
• Consumer electronics
• Telecommunications equipment
• Energy storage devices
• Power electronics and modules
• Automotive control units and sensors
• Computing components (CPUs, GPUs, memory)

Related Documents

Literature and Reference Materials
Datasheet: THERM-A-GAP GEL 60HF
Dispensing Guide: Thermal Interface Materials
Application Guide: Instructions for Stenciling THERM-A-GAP GEL 60HF
Application Note: Recommended Vessel Options for 30cc Syringes
Product Catalog: Thermal Interface Materials
Shelf Life and Material Re-Certification for Thermal Interface Materials
White Paper: Choosing Between Thermal Gels and Thermal Gap Filler Pads

Contact & Support Information
Request a Chomerics Product Sample
Find Your Local Parker Chomerics Sales Rep or Distributor
Request a Quote

Compliance, Certifications & Safety
Test Report: THERM-A-GAP GEL 60HF Reliability Report
Parker Chomerics Safety Data Sheets (SDS)
Product Compliance: China RoHS Compliant
Product Compliance: EU PFOS Compliant
Product Compliance: EU RoHS Compliant
Product Compliance: REACH SVHC Meets Requirements