Thermally Conductive Liquid Dispensed Adhesives

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Thermally Conductive Liquid Dispensed Adhesives

Thermally Conductive Liquid Dispensed Adhesives

Whether you need structural integrity or an improved thermal connection, these adhesives allow design flexibility and the ability to bond a variety of substrates. Our adhesives couple high-bond strength with thermal conductivity for ease of use and cost-savings.

CoolTherm® MD-140 silver-filled conductive adhesive offers excellent thermal conductivity. It is designed for use in thermally demanding die attach applications. It is low stress, making it suitable for use with large die.
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CoolTherm® MD-140 SP (Small Particle) silver-filled conductive adhesive offers excellent thermal conductivity. It is designed for use in thermally demanding die attach applications. It is low stress, making it suitable for use with large die.
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CoolTherm® EP-6006 HS/6011 epoxy system is a two-component, pourable, ceramic-filled epoxy for bonding current-carrying conductors. Specifically formulated to meet UL 94 V-0 non-burning requirements.
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CoolTherm® EP-6007 BLK/6010 epoxy system is used as a thermally conductive, thin bondline adhesive for attaching semiconductors to heat sinks, and as a potting/casting product when thermal conductivity & non-burning properties are required.
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CoolTherm® EP-6007 BLK/Thermoset® No.67 epoxy system is used as a thermally conductive, thin bondline adhesive for attaching semiconductors to heat sinks, and as a potting/casting product when thermal conductivity & non-burning properties are required.
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CoolTherm® EP-6037/6010 epoxy system is a two-component epoxy system primarily used by the semiconductor industry to form thermally conductive joints in fabricated heat sinks and between heat sinks and power devices.
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CoolTherm® EP-6037/6252 epoxy system is a two-component epoxy system primarily used by the semiconductor industry to form thermally conductive joints in fabricated heat sinks and between heat sinks and power devices.
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CoolTherm® EP-6150 adhesive is a one-component, thixotropic epoxy adhesive for use in the assembly of electronic components and devices. Offers good adhesion to wide variety of substrates; can be used in demanding high-end device assembly applications.
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CoolTherm® EP-6151 adhesive is a one-component, aluminum-filled epoxy adhesive designed for use as a thermal interface adhesive for heat sink attachment and other applications requiring good adhesion and heat transfer properties.
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CoolTherm® EP-6960 silver-filled conductive adhesive offers excellent electrical conductivity and room temperature stability. It is designed for use with automated dispensing, stamping and screen-printing application equipment.
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CoolTherm® EP-6972 adhesive is a two-component, silver-filled, epoxy conductive adhesive which offers good electrical and thermal conductivity. This adhesive system requires an elevated temperature cure, and is designed for general circuit board repair.
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CoolTherm® EP-96 adhesive is a one-component, thixotropic epoxy adhesive for use in the assembly of electronic components and devices. This adhesive is a modified version of CoolTherm EP-6150 adhesive with enhanced air-release characteristics.
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CoolTherm® MT-125 thermally conductive adhesive is a rapid cure, one-component adhesive specifically designed for applications requiring a long working life adhesive with high thermal conductivity.
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CoolTherm® MT-220C thermally conductive adhesive is a fast cure, one-component, silicone hybrid adhesive used for bonding silicone to silicone and metal to metal, as well as ceramic, plastic or metal lids to a heat sink.
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CoolTherm® MT-322 thermally conductive adhesive is a one-component silicone adhesive for use in assemblies where thermal dissipation is desired. Adhesive cures to form flexible elastomer offering superior high temperature electrical properties.
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CoolTherm® TC-2002 adhesive is a two-component adhesive system designed for use in structural bonding applications which require thermal conductivity with high bond strength.
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This product is no longer available - please contact us for further assistance.
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