Parker Chomerics THERM-A-GAP PAD 30 is a thermally conductive gap filler pad with 3.2 W/m-K thermal conductivity and 34 Shore 00 hardness.
THERM-A-GAP PAD 30 is the next generation in the THERM-A-GAP thermal pad family, and offers the compelling combination of both excellent thermal performance and conformability, along with the lowest outgassing to provide an effective thermal interface between heat sinks and electronic devices where there are uneven surfaces, air gaps and rough surface textures.
THERM-A-GAP PAD 30 has been specifically formulated to conform to surface irregularities and adhere to a wide range of component shapes and sizes.
THERM-A-GAP PAD 30 is available in various thicknesses and finished in standard sheets of 9"x9" or 18"x18". Custom size configurations and die cut parts are available as individual parts or on sheets. To receive a quote on a custom size part, choose your thickness and carrier options, and then select “custom” size.
Features / Benefits:
• 3.2 W/m-K thermal conductivity
• Ultra low deflection force
• High thermal conductivity
• High tack surface reduces contact resistance
• “A” version offers high strength acrylic PSA for permanent attachment
• UL recognized V-0 flammability RoHS compliant
Available Carriers:
• G – woven glass (no PSA) - this carrier option provides reinforcement and a clean break / low tack interface surface, allowing for re-use of the pad if necessary or for prototyping.
• A – aluminum foil (with PSA) - this carrier’s primary function is to allow a pressure sensitive adhesive on the gap pad.
• PN – PEN film - polyethylenenapthalate - this carrier permits the gap pad to see a shearing motion and offers a clear, cost effective dielectric film with fair thermal performance.
• KT – thermally enhanced polyimide – this carrier permits the gap pad to see a shearing motion and offers an excellent dielectric film with enhanced thermal performance.
• No carrier (no letter distinction) - the no carrier or “un-reinforced” option allows the gap pad to have high tack surfaces on both sides, allowing for the pad to be highly conformable, but it does make cutting and handling of the product more difficult.
Typical Applications:
• Telecommunications equipment
• Consumer electronics
• Automotive electronics (ECUs)
• LEDs, lighting
• Power conversion
• Desktop computers, laptops, servers
• Handheld devices
• Memory modules
• Vibration dampening
