CHO-BOND 592 CONDUCTIVE EPOXY ADHESIVE | #50-01-0592-0000


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50-01-0592-0000

CHO-BOND 592 CONDUCTIVE EPOXY ADHESIVE | #50-01-0592-0000

Parker Chomerics CHO-BOND® 592 conductive adhesive is a two-component, silver-filled epoxy with good electrical conductivity and excellent adhesion characteristics


Technical Specifications

  • Weight (g): 500
  • Polymer Material Options: Epoxy
  • Filler Material: Silver
  • Specific Gravity: 2.6
  • Volume Resistivity: 0.050 Ω-cm
  • Lap Shear Strength: 10300 kPa
  • Shelf Life: 9 Months
  • Ratio: 100:50:00
Safety Warning

Item Information

Parker Chomerics CHO-BOND® 592 conductive adhesive is a two-component, silver-filled epoxy with good electrical conductivity and excellent adhesion characteristics. CHO-BOND® 592 is ideal in connecting dissimilar materials both electrically and thermally.

Features and Benefits:
• Long pot life (4-6 hours at 25°C) allows for application flexibility
• Room temperature curing available
• Excellent thermal properties (low thermal impedance and good thermal shock resistance)
• Can be thinned for spray applications
• Good electrical conductivity (0.05 ohm-cm)
• Great adhesion strength (1500 PSI lap shear)

Typical Applications:
• Sealant for microwave modules and components
• Circuit board repair
• Grounding applications
• EMI shielding applications

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Where to Buy

Local Contact

South Africa Headoffice

Parker Hannifin (Africa) Pty LTD

Sales Company South Africa

10 Berne Avenue

Aeroport

Kempton Park

Gauteng

South Africa

1620

Phone

0027 11 961 0700

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