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Parker Chomerics CHO-BOND® 592 conductive adhesive is a two-component, silver-filled epoxy with good electrical conductivity and excellent adhesion characteristics
Parker Chomerics CHO-BOND® 592 conductive adhesive is a two-component, silver-filled epoxy with good electrical conductivity and excellent adhesion characteristics. CHO-BOND® 592 is ideal in connecting dissimilar materials both electrically and thermally. Features and Benefits:• Long pot life (4-6 hours at 25°C) allows for application flexibility• Room temperature curing available• Excellent thermal properties (low thermal impedance and good thermal shock resistance)• Can be thinned for spray applications• Good electrical conductivity (0.05 ohm-cm)• Great adhesion strength (1500 PSI lap shear)Typical Applications:• Sealant for microwave modules and components• Circuit board repair• Grounding applications• EMI shielding applications
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South Africa Headoffice
Parker Hannifin (Africa) Pty LTD
Sales Company South Africa
10 Berne Avenue
Aeroport
Kempton Park
Gauteng
South Africa
1620
Phone
0027 11 961 0700
Create one account to manage everything you do with Parker, from your shopping preferences to your application access.