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Parker Chomerics CHO BOND® 4669 is a one-component, silver-plated copper filled conductive sealant specifically formulated for extended working life and flexibility in applications where vibration resistance is required
Parker Chomerics CHO BOND® 4669 is a one-component, silver-plated copper filled conductive sealant specifically formulated for extended working life and flexibility in applications where vibration resistance is required. CHO BOND® 4669 is a gray-colored material that possesses identical properties of CHO BOND® 4660 except for an enhanced working life.
Features and Benefits:
• One-component system so no mixing or measuring required
• Good conductivity levels (0.080 ohm-com)
• No corrosive by-products generated during drying
• No primer required
• Excellent impermeability to gases
• Minimal weight added to assembly due to lightweight material
• Easily dispensed using a standard caulking gun
• 2 hour working life for applications flexibility
Typical Applications:
• Access panels
• Shielded room joints
• Temporary military shelters
• Hardware
• Bulkhead feed-through fittings
• Building conduits
No CAD files available
South Africa Headoffice
Parker Hannifin (Africa) Pty LTD
Sales Company South Africa
10 Berne Avenue
Aeroport
Kempton Park
Gauteng
South Africa
1620
Phone
0027 11 961 0700
Create one account to manage everything you do with Parker, from your shopping preferences to your application access.