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Parker Chomerics CHO-BOND® 584-29 conductive adhesive is a two-component, silver-filled epoxy formulated for thin bond lines and where precise application is required
Literature and Reference Materials |
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Datasheet: CHO-BOND 584-29 Syringe Kit |
Datasheet: CHO-BOND® 584-29 |
Contact & Support Information |
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Request a Chomerics Product Sample |
Find Your Local Parker Chomerics Sales Rep or Distributor |
Request a Quote |
Products | Packaging |
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50-10-0584-0029 | 1 gram, 2 component, premeasured CHO-PAK |
50-02-0584-0029 | 2.5 gram, 2 component, premeasured CHO-PAK |
50-30-0584-0029 | 3 gram, 2 component, premeasured, syringe kits (10 total) |
50-03-0584-0029 | 10 gram, 2 component, premeasured CHO-PAK |
50-00-0584-0029 | 4 fluid ounce, 2 component, polypropylene kit |
50-01-0584-0029 | 8 fluid ounce, 2 component, polypropylene kit |