CHO-BOND 4660 Silver-Plated Copper Filled Polyisobutylene Electrically Conductive Sealant | Product Series

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CHO-BOND 4660 Silver-Plated Copper Filled Polyisobutylene Electrically Conductive Sealant

CHO-BOND 4660 Silver-Plated Copper Filled Polyisobutylene Electrically Conductive Sealant

Parker Chomerics CHO BOND® 4660 is a one-component, silver-plated copper filled conductive sealant specifically formulated for flexibility in applications where vibration resistance is required

Technical Specifications

  • Polymer Material Options: Polyisobutylene
  • Filler Material: Silver-plated Copper
  • Package Type: 2 Fluid Ounce Aluminum Foil Tube, 0.1 Gallon Fiber Cartridge
  • Primer Included: Not Required
  • Color: Black
  • Volume Resistivity: 0.080 Ω-cm
  • Specific Gravity: 2.06
  • Durometer: n/a
  • Operating Temperature: -55 to 100 °C
  • Operating Time: 0.5 Hours
  • Shelf Life: 6 Months
  • Film Thickness: 0.18 to 3.18 mm
Safety Warning

Full Product Description

Parker Chomerics CHO BOND® 4660 is a one-component, silver-plated copper filled conductive sealant specifically formulated for flexibility in applications where vibration resistance is required. CHO BOND® 4660 is a black-colored material that possesses identical properties of CHO BOND® 4669 except for a shortened working life.

Features and Benefits:
• One-component system so no mixing or measuring required
• Good conductivity levels (0.080 ohm-com)
• No corrosive by-products generated during drying
• No primer required
• Excellent impermeability to gases
• Minimal weight added to assembly due to lightweight material
• Easily dispensed using a standard caulking gun

Typical Applications:
• Access panels
• Shielded room joints
• Temporary military shelters
• Hardware
• Bulkhead feed-through fittings
• Building conduits

Related Documents

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Products Weight (g)
51-02-4660-0000 113.4
51-05-4660-0000 681

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