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Parker Chomerics CHO BOND® 4660 is a one-component, silver-plated copper filled conductive sealant specifically formulated for flexibility in applications where vibration resistance is required
| Literature and Reference Materials |
|---|
| Datasheet: CHO-BOND® 4660 and 4669 |
| Products | Weight (g) |
|---|---|
| 51-02-4660-0000 | 113.4 |
| 51-05-4660-0000 | 681 |