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Parker Chomerics CHO BOND® 1121 is a one component, VOC-free, silver-plated copper filled sealant formulated to serve as gap filler for EMI shielding or electrical grounding
Literature and Reference Materials |
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Application Note: How to Apply CHO-BOND 1121 |
Datasheet: CHO-BOND® 1038 and 1121 |
Contact & Support Information |
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Request a Chomerics Product Sample |
Find Your Local Parker Chomerics Sales Rep or Distributor |
Request a Quote |
Products | Weight (g) | Packaging |
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50-01-1121-0000 | 454 | 6 fluid ounce SEMCO cartridge |