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Parker Chomerics CHO-BOND® 1085 is an air-drying liquid coating used to improve the adhesion of Parker Chomerics CHO-BOND 1029 adhesive to metal and other non-silicone substrates.
Literature and Reference Materials |
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Datasheet: CHO-BOND® 1085 |
Contact & Support Information |
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Products | Weight (g) |
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50-01-1085-0000 | 400 |