CHO-BOND 592 CONDUCTIVE EPOXY ADHESIVE | Product Series

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CHO-BOND 592 CONDUCTIVE EPOXY ADHESIVE

CHO-BOND 592 CONDUCTIVE EPOXY ADHESIVE

Parker Chomerics CHO-BOND® 592 conductive adhesive is a two-component, silver-filled epoxy with good electrical conductivity and excellent adhesion characteristics

Technical Specifications

  • Polymer Material Options: Epoxy
  • Filler Material: Silver
  • Specific Gravity: 2.6
  • Volume Resistivity: 0.050 Ω-cm
  • Lap Shear Strength: 10300 kPa
  • Shelf Life: 9 Months
  • Ratio: 100:50:00
Safety Warning

Full Product Description

Parker Chomerics CHO-BOND® 592 conductive adhesive is a two-component, silver-filled epoxy with good electrical conductivity and excellent adhesion characteristics. CHO-BOND® 592 is ideal in connecting dissimilar materials both electrically and thermally.

Features and Benefits:
• Long pot life (4-6 hours at 25°C) allows for application flexibility
• Room temperature curing available
• Excellent thermal properties (low thermal impedance and good thermal shock resistance)
• Can be thinned for spray applications
• Good electrical conductivity (0.05 ohm-cm)
• Great adhesion strength (1500 PSI lap shear)

Typical Applications:
• Sealant for microwave modules and components
• Circuit board repair
• Grounding applications
• EMI shielding applications

Related Documents

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Products Weight (g)
50-01-0592-0000 500
50-00-0592-0000 85

687466
179336