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Parker Chomerics THERM-A-GAP™ GEL 75 fully cured dispensable gel has 7.5 W/m-K Thermal Conductivity as a one component fully cured system.
Parker Chomerics THERM-A-GAP GEL 75 is a high performance, one component, dispensable thermal interface material with 7.5 W/m-K thermal conductivity developed to conduct heat from electronics to a heat sink or enclosure.
The material’s heavy paste-like consistency enables controlled dispensing, applied in variable thicknesses to suit application needs. THERM-A-GAP GEL 75 requires low compressive force to deform under assembly pressure subjecting components, solder joints and leads to minimal stresses.
It is formulated to accommodate today’s high performance electronics and is ideal for automated dispensing machines, rework and field repair situations.
Features and Benefits:
• Thermal conductivity: 7.5 W/m-K
• Easily dispensed
• No secondary curing required
• Low thermal impedance
• Low compression force
• Reworkable
Typical Applications:
• Thermal heat dissipation for telecom base stations
• Power supplies and semiconductors
• Memory and power modules
• Microprocessors
•Central processing units (CPUs)
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Chomerics Division Europe
Unit 6, Century Point
Halifax Road
High Wycombe
Bucks
United Kingdom
HP12 3SL
Teléfono
+44 1494 455400
Fax
+44 1494 455466
Cree una cuenta para gestionar todo lo que haga con Parker, desde sus preferencias de compra hasta su acceso a la aplicación.