Consiga su cuenta de Parker hoy mismo!
Cree una cuenta para gestionar todo lo que haga con Parker, desde sus preferencias de compra hasta su acceso a la aplicación.
Parker Chomerics CHO-BOND® 592 conductive adhesive is a two-component, silver-filled epoxy with good electrical conductivity and excellent adhesion characteristics
Parker Chomerics CHO-BOND® 592 conductive adhesive is a two-component, silver-filled epoxy with good electrical conductivity and excellent adhesion characteristics. CHO-BOND® 592 is ideal in connecting dissimilar materials both electrically and thermally. Features and Benefits:• Long pot life (4-6 hours at 25°C) allows for application flexibility• Room temperature curing available• Excellent thermal properties (low thermal impedance and good thermal shock resistance)• Can be thinned for spray applications• Good electrical conductivity (0.05 ohm-cm)• Great adhesion strength (1500 PSI lap shear)Typical Applications:• Sealant for microwave modules and components• Circuit board repair• Grounding applications• EMI shielding applications
No hay archivo CAD disponible
Chomerics Division Europe
Unit 6, Century Point
Halifax Road
High Wycombe
Bucks
United Kingdom
HP12 3SL
Teléfono
+44 1494 455400
Fax
+44 1494 455466
Cree una cuenta para gestionar todo lo que haga con Parker, desde sus preferencias de compra hasta su acceso a la aplicación.