Parker Chomerics THERM-A-GAP™ GEL 40NS is a fully cured, non-silicone dispensable gel designed to conduct heat between hot components and a heat sink or enclosure. It has a 4.0 W/m-K thermal conductivity and is able to achieve very low thermal impedance and thin bond lines, down to 0.006”. GEL 40NS requires very low compressive forces to deform, transferring very low assembly pressures to components, solder joints, and leads. The unique urethane binder enables this material to be used where silicone thermal materials are prohibited due to silicone residue or unwanted byproducts.
Features and Benefits:
• Easily Dispensable
• High bulk thermal conductivity
• Non-silicone
• No secondary curing required
• No pump out
• Low thermal impedance
• Ultra-low compression force
• Reworkable
• No pump out
Product Attributes:
• Non-silicone binder system is ideal for optical applications and silicone-free facilities
• Provides low thermal impedance at thin and thick gaps
• Accommodates variety of bond line thicknesses
• Compatible with high volume, automated dispense equipment
• Proven reliability in extreme temperature cycling and shock & vibration
• Deflects easily under low compressive forces, decreasing stress on components and therefore decreasing component failure
Typical Applications:
• Automotive electronic control units (ECUs)
• Telecommunications base stations
• Power suppliers and semiconductors
• Memory and power modules
• Flat panel displays and consumer electronics
• Microprocessors and graphics processors
