THERM-A-FORM T642 Cure-in-Place Potting and Underfill Materials | Product Series

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THERM-A-FORM T642 Cure-in-Place Potting and Underfill Materials

THERM-A-FORM T642 Cure-in-Place Potting and Underfill Materials

Parker Chomerics THERM-A-FORM™ T642 is a two-component, silicone elastomer with 1.20 W/m-k thermal conductivity and ideal for underfilling applications.

Especificaciones técnicas

  • Color: Blue
  • Opciones de material de polímero: Silicone Rubber (VMQ, PVMQ)
  • Material de relleno: Boron Nitride
  • Tipo de productos: 2-part
  • Gravedad específica: 1.5
  • Durómetro: 70 Shore A
  • Viscosidad dinámica: 2500 P
  • Duración de la vida útil: 60 min Pot Life
  • Tiempo máximo de endurecimiento (a temperatura ambiente): 3 min @ 150°C, 30 min @ 70°C, 48 Hours @ 23°C
  • Conductividad térmica: 1.2 W/m-K
  • Capacidad de calefacción: 1 J/g-K
  • Coeficiente de expansión térmica: 300 ppm/K
  • Temperatura de funcionamiento: -58 to 302 °F, -50 to 150 °C
  • Resistencia dieléctrica: 200 kVAC/mm, 500 VAC/mil
  • Resistividad volumétrica: 10^13 (x1) ohm-cm
  • Constante dieléctrica: 4 @ 1 MHZ
  • Factor de disipación: 0.001 @ 1 MHZ
  • Clasificación de inflamabilidad: Not Tested
  • Pérdida de masa total de desgasificación: 0.32 % TML (0.21% CVCM)
  • Vida útil en depósito: 3 Months
  • Peso: 53 g, 372 g
  • Relación: 10:1 Mix Ratio (by weight)
Safety Warning

Descripción completa del producto

Parker Chomerics THERM-A-FORM™ T642 is a two-component, silicone elastomer with 1.20 W/m-k thermal conductivity and ideal for underfilling applications.

THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics cooling applications. These versatile liquid reactive materials can be dispensed and then cured into complex geometries for cooling of multi-height components on a PCB without the expense of a molded sheet. Each compound is available in ready-to-use cartridge systems, eliminating weighing, mixing, and degassing procedures.

Product Attributes:
• High thermal performance with flexibility
• Ideal for underfilling
• Low outgassing
• Boron Nitride filled material

Features and Benefits:
• Dispensable form-in-place gap filling, potting, sealing, and encapsulating
• Excellent blend of high thermal conductivity, flexibility, and ease of use
• Conformable to irregular shapes without excessive force on components
• Ready-to-use cartridge system eliminates weighing, mixing, and de-gassing steps
• Variety of kit sizes and configurations available to suit any application (handheld twin-barrel cartridges, Semco® tubes, and pneumatic applicators)
• Vibration damping

Documentos relacionados

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Productos Tipo de paquete
65-00-T642-0035 45cc Dual Element Cartridge
65-00-T642-0250 200cc Dual Element Cartridge

687PDC
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