Parker Chomerics T670 Thermal Grease is a high performance (3.0 W/m-k thermal conductivity) grease ideal for thin bond line applications. T670 is a white material and offers low thermal impedance as it will achieve a very thin bond line of about 0.001 in.Chomerics thermal greases offer a range of performance covering the simplest to the most demanding thermal requirements. These materials are screened, stenciled or dispensed and require virtually no compressive force to conform under typical assembly pressures. The excellent surface wetting results in low interfacial resistance. Features and Benefits:• Silicone based materials conduct heat between a hot component and a heat sink or enclosure• Fills interface variable tolerances in electronics assemblies and heat sink applications• Dispensable, highly conformable materials require no cure cycle, mixing or refrigeration• Thermally stable and require virtually no compressive force to deform under typical assembly pressures• Supports high power applications requiring material with minimum bond line thickness and high conductivity• Ideal for rework and field repair situations
