Parker Chomerics PARPHORM® is a family of non-conductive form-in-place elastomeric sealing compounds. The product line consists of state-of-the-art compounds designed to be robotically dispense onto small housings and then cured. Dispensed beads range from 0.018 in (0.46 mm) to 0.062 in (1.57 mm).

Parker Chomerics PARPHORM® L1938 fluorosilicone form-in-place material is a thermal cure system specially designed for fluid resistance applications. It has a Shore A hardness of 45 and compression set of 14%. As a fluorosilicone, PARPHORM® L1938 is highly resistant to a wide variety of caustic fluids. The fast full cure cycle time of 30 minutes at 140°C allows for immediate handling and quick turn-around for QC testing. The parts can be immediately packaged and shipped post cure, allowing for shorter lead times and easy integration into final assemblies.

Features and Benefits:
• One component thermal cure material
• Excellent resistance to a wide variety of fluids
• Excellent adhesion to a wide variety of substrates (aluminum, phenolic resins, copper, stainless steel, glass, PVC, ceramics, and many plastics)
• Low material and installation costs

Typical Applications:
• Densely populated electronics packaging
• Aluminum, copper, stainless steel, glass, ceramics, and plastic housings