CoolTherm® EP-6037/6010 epoxy system is a two-component epoxy system primarily used by the semiconductor industry to form thermally conductive joints in fabricated heat sinks and between heat sinks and power devices. CoolTherm EP-6037/6010 epoxy system can also be used for bonding semiconductors and transistors to heat sinks, and for general purpose bonding of electronic components.
Features and Benefits:
• Low Stress – exhibits low shrinkage and stress on components as it cures.
• Excellent Adhesion – provides a strong adhesion bond to a wide variety of substrates.
• Low Coefficient of Thermal Expansion – minimizes the possibility of cracking during severe temperature cycling.
Shelf Life/Storage:
Shelf life for each component is one year when stored at 25°C in original, unopened container.
